Huawei is developing a true 5 nm production line without the need for EUV lithography machines. Furthermore, 3 nm chips are already in the R&D stage, with plans to start production by 2026, according to a report by UDN.
Huawei cannot use standard EUV technology, as it is patented by the Dutch company ASML, which is banned from working with the Chinese manufacturer. Instead, the company is using SSA800 lithography machines with multi-patterning, made by Shanghai Micro Electronics (SMEE).
Research and development for 3nm chips are following two approaches: one is GAA architecture (the standard one, used by TSMC and Samsung), and the other is a carbon nanotube-based chip that has already completed lab validation and is now being adapted for SMIC’s production lines.
Earlier this month, the Huawei Matebook Fold arrived, powered by Kirin X90. While the company calls it a “5nm chip,” it is actually a 7nm design with advanced packaging technology. It brings performance on par with other 5 nm chips, but the yield is only 50%, which is extremely low, making the chip more expensive to manufacture.
